This is the PCB for BearlyML 22 SoC chip, designed by EE 194/290C students in Spring 2022.
The design consists of two boards. The Module Board breaks out the chip BGA signals to the SODIMM connector. The Carrier Board contains most of the IO modules and level shifters. The Carrier Board can be swapped to different designs for different bringup setups or demo applications.
BearlyML 2022 SoC Specification
PCB Project on Altium 365 - Module
PCB Project on Altium 365 - Carrier
Key | Value |
---|---|
Build Time | 5-6 days |
Layers | 6 |
PCB Qty | 5 |
PCB Thickness | 1.2 mm for Module Board; 1.6 mm for Carrier Board |
Base Material | FR-4 |
Material Type | FR4-Standard TG 135-140 |
Dimension | 79.6 mm* 71 mm for Module Board; 100 mm* 92 mm for Carrier Board |
Product Type | Industrial/Consumer electronics |
Impedance Control | no |
Silkscreen | White |
PCB Color | Black |
Surface Finish | ENIG Gold Thickness: 1 U" |
Via Covering | Epoxy Filled & Capped |
Via Type | via-in-pad |
Outer Copper Weight | 1 oz |
Inner Copper Weight | 0.5 oz |
Castellated Holes | no |
Min hole size/diameter | 0.2/0.45mm |
Flying Probe Test | Fully Test |
Gold Fingers | Yes for Module Board |
Remove Order Number | Specify a location |
Appearance Quality | IPC Class 2 Standard |
Silkscreen Technology | Ink-jet/Screen Printing Silkscreen |
Manufactured with JLCPCB.
PCB: $18.58 each
Assembly: $17.64 each excluding BOM part cost
PCB: $17.81 each
Assembly: $21.90 each excluding BOM part cost
Total: $380 for 5 pcs