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@string{aps = {American Physical Society,}}
@conference{Jagini2024-qi,
title = {Data discovery and indexing for semi-structured scientific data},
author = {Jagini, Kaushik and Zhang, Yifan and Guo, Yichen and Goddy,
Julian and Stansberry, Dale and Agar, Joshua and Heflin, Jeff},
year = {2024},
booktitle = {Proceedings of the 26th International Conference on Enterprise
Information Systems},
publisher = {SCITEPRESS - Science and Technology Publications},
eventtitle = {26th International Conference on Enterprise Information Systems},
venue = {Angers, France},
eventdate = {2024-04-28},
pages = {264--271},
year = {2024},
doi = {10.5220/0012706000003690},
abstract = {There is a need for powerful, user-friendly tools for scientific
data management and discovery. We present an architecture based
on DataFed and Elasticsearch that allows scientists to easily
share data they produce and a novel interface that allows other
scientists to easily discover data of interest. This interface
supports summary- level information about a collection of
datasets that can be easily refined using schema-free search. We
extend the recent idea of cell-centric search to semi-structured
data, describe the architecture of the system, present a use
case from the context of materials science, and evaluate the
efficacy of the system.},
url = {https://www.researchgate.net/publication/380306430_Data_Discovery_and_Indexing_for_Semi-Structured_Scientific_Data},
html = {https://www.researchgate.net/publication/380306430_Data_Discovery_and_Indexing_for_Semi-Structured_Scientific_Data},
pdf = {2024SciteJagini.pdf},
preview = {2024SciteJagini.png},
altmetric = {true},
dimensions = {true},
selected = {true},
}
@conference{Agar2010-ot,
title = {Novel {PDMS}(silicone)-in-{PDMS}(silicone): Low cost flexible
electronics without metallization},
author = {Agar, Joshua C and Lin, Katy J and Zhang, Rongwei and Durden,
Jessica and Moon, Kyoung-Sik and Wong, C P},
booktitle = {2010 Proceedings 60th Electronic Components and Technology
Conference (ECTC)},
publisher = {IEEE},
eventtitle = {2010 Proceedings 60th Electronic Components and Technology
Conference (ECTC)},
venue = {Las Vegas, NV, USA},
eventdate = {2010-06-01},
pages = {1226--1230},
year = {2010},
doi = {10.1109/ectc.2010.5490654},
abstract = {Future electronics will undoubtedly require natural integration
at the system, device and package level in the form of a
functional, flexible package. Functional, flexible electronics
expand the functionality of devices allowing
morphological-electronic response for ergonomic and natural
interfaces between the device and its surroundings. Recent
technological successes have been able to fabricate functional,
flexible electronics, however have all failed to develop a
package capable of meeting the stringent cost, reliability and
performance required of consumer electronics. We demonstrate the
application of electrically conductive adhesive technology to
produce low cost, flexible electronics without metallization. We
have shown the capability of fabrication of highly conductive
Poly(dimethylsiloxane) (PDMS) (rho~7x10-4 Ω-cm) by incorporation
of 80 wt\% bimodal distribution of micron sized silver flakes.
PDMS is both the ideal substrate and composite matrix material
due to its unique properties; PDMS is optically transparent,
viscoelastic, chemically and thermally stable, highly flexible,
hydrophobic and can easily be molded with high resolution and
aspect ratio. These unique properties of PDMS allow for high
resolution molds to be prepared from photolithographically
defined substrates. Screen printing of electrically conductive
PDMS into these molds with micro- sized features creates a low
cost, flexible electronic package. We have coined this package
PDMS-in-PDMS. We show that PDMS ECA can be prepared by curing a
novel formulation of PDMS at curing temperatures of 150 °C for
15 minutes. Upon curing, the ECA undergoes a transition from
insulating to conductive. TMA results have shown that this
transition is due to ECA shrinkage >20\%. Furthermore, we show
simultaneous conductivity and tensile strain measurements to
show the electrical properties of PDMS ECA are unaffected by
tensile strains of >40\%. We show the feasibility of this
technology to create low cost, flexible devices without the need
for metallization.},
url = {https://ieeexplore.ieee.org/document/5490654},
html = {https://ieeexplore.ieee.org/document/5490654},
pdf = {2010IEEEPDMSAgar.pdf},
preview = {2010IEEEPDMSAgar.gif},
altmetric = {true},
dimensions = {true},
selected = {true},
}
@conference{Orecchini2010-ny,
title = {Inkjet printed organic transistors for sustainable electronics},
author = {Orecchini, G and Zhang, R and Agar, J and Staiculescu, D and
Tentzeris, M M and Roselli, L and Wong, C P},
booktitle = {2010 Proceedings 60th Electronic Components and Technology
Conference (ECTC)},
publisher = {IEEE},
eventtitle = {2010 Proceedings 60th Electronic Components and Technology
Conference (ECTC)},
venue = {Las Vegas, NV, USA},
eventdate = {2010-06-01},
pages = {985--989},
year = {2010},
doi = {10.1109/ectc.2010.5490659},
abstract = {Embedded paper electronics is a promising solution for the
future of electronics, and thus the goal for this paper is to
show the pathway toward achieving inkjet solutions for the
realization of complex circuitry on the cheapest synthetic
material made by humankind: PAPER. A direct write technology,
inkjet printing transfers the designed pattern directly to the
substrate. Inkjet technologies have gained a lot of ground as a
more accurate and economic fabrication method than traditional
lithography.The challenge of this work is to identify the right
materials and to show the printability of all the building
blocks of an organic field-effect transistor (OTFT). For the
semiconductor, a highly soluble pentacene precursor,
13,6-N-Sulfinylacetamidopentacene, is proposed. Anisole, a high
boiling point solvent is chosen to insure proper jetting of the
solution. The solution jets well and it has to be used right
after preparation as its printability degrades with time. For
the gate dielectric, two solutions are proposed: (i) using the
paper itself as an insulator and print a bottom gate device on
both sides of a double sided glossy paper, (ii) a pentacene
impurity, of 6,13-pentacenequinone (PQ), in a top gate
configuration, which may improve the device mobility by reducing
the scattering sites at the semiconductor-dielectric interface.
For the electrodes, a printable nano-particle based silver ink
has to be modified to match the work function with pentacene, or
replaced with an alternate printable material like Carbon
Nanotubes (CNTs). Preliminary electrical testing of the
pentacene film printed directly on paper shows good conduction
properties for a 25 μm channel length. Further improvement of
the pentacene film performance is proposed. This work
establishes the foundation for the first fully printed OTFT on
paper.},
url = {http://ieeexplore.ieee.org/document/5490659/},
html = {http://ieeexplore.ieee.org/document/5490659/},
pdf = {2010IEEEOrecchini.pdf},
preview = {2010IEEEOrecchini.gif},
altmetric = {true},
dimensions = {true},
selected = {true},
}
@conference{Agar2010-ju,
title = {Deconstructing the myth of percolation in electrically
conductive adhesives and its implications},
author = {Agar, Joshua C and Lin, Katy J and Zhang, Rongwei and Durden,
Jessica and Lawrence, Kevin and Moon, Kyoung-Sik and Wong, C P},
booktitle = {2010 Proceedings 60th Electronic Components and Technology
Conference (ECTC)},
publisher = {IEEE},
eventtitle = {2010 Proceedings 60th Electronic Components and Technology
Conference (ECTC)},
venue = {Las Vegas, NV, USA},
eventdate = {2010-06-01},
pages = {1713--1718},
year = {2010},
doi = {10.1109/ectc.2010.5490742},
abstract = {The modern emphasis on green technologies has caused the
electronics industry to seek alternative solutions to lead-
based interconnections. Electrically conductive adhesive (ECAs)
composed of metallic fillers within a polymer matrix have
received the majority of the interest in lead-free interconnect
technology. However, ECAs are still unable to meet the demands
of high performance consumer electronics. Previous research
recognized a critical filler concentration where there is a
dramatic increase in conductivity, followed by a plateau.
Researchers have labeled this transition as evidence of a
percolation, implying a continuous interconnected metallic
network. Our work comprised of a series of "proof of concept"
type experiments deconstructs the myth of percolation and
emphasize the functional role of the polymer matrix. From a
theoretical standpoint direct metal to metal contact is not
feasible since silver particles coated with short chain acids
are easily wet by the polymer matrix. Assembly conducted under
low mechanical stresses is unable to displace the adsorbed
surfactant to form metallic contact. Moreover, preparation of a
high K epoxy (Dielectric Constant ~5.5), Co(III)
acetylacetonates (Co(III) AcAcs) doped diglycidyl ether of
bisphenol F had unstable conductivities orders of magnitude
lower than the control samples; under similar applied DC.
Dielectric constant has a minimal effect if metal to metal
contact is the dominant charge transport mechanism. However,
tunneling through materials with high dielectric constant
impedes the tunneling efficiency. We clearly demonstrate that
charge transport at the interface occurs via secondary
conductivity pathways, dominated by thermally assisted tunneling
mechanisms. The importance of these secondary conductivity
mechanisms is highly dependent on the particle-thin film
dielectric interaction. This revolutionary discovery provides a
new approach for scientists and engineers to improve the
performance of electrically conductive adhesives through the
incorporation of electrically functional matrix materials.},
url = {https://ieeexplore.ieee.org/document/5490742},
html = {https://ieeexplore.ieee.org/document/5490742},
pdf = {2010IEEEECTCAgar.pdf},
preview = {2010IEEEECTCAgar.gif},
altmetric = {true},
dimensions = {true},
selected = {true},
}
@conference{Moon2010-zl,
title = {Graphene for ultracapacitors},
author = {Moon, K and Li, Z and Yao, Y and Lin, Z and Liang, Q and Agar, J
and Song, M and Liu, M and Wong, C P},
booktitle = {2010 Proceedings 60th Electronic Components and Technology
Conference (ECTC)},
publisher = {IEEE},
eventtitle = {2010 Proceedings 60th Electronic Components and Technology
Conference (ECTC)},
venue = {Las Vegas, NV, USA},
eventdate = {2010-06-01},
pages = {1323--1328},
year = 2010,
doi = {10.1109/ectc.2010.5490644},
abstract = {Graphene, the basic building block of all graphitic materials
has received significant scientific interest due to its
ultra-high surface area (>2,630 m2/g), high charge carrier
mobility, high thermal conductivity, etc. In particular,
graphenes high surface area and excellent electrical
conductivity has made it a leading candidate for next generation
electrode material in energy storage devices such as
ultracapacitors. One of the approaches for high volume
production of graphene is the reduction of exfoliated graphite
oxide (GO) sheets by thermal annealing, and/or reducing agents.
However, the high temperature annealing process consumes a large
amount of energy. Furthermore, large quantities of toxic
reducing agents such as hydrazine and dimethylhydrazine are
required. In this paper microwave (MW) assisted heating is
studied as a scalable approach for the synthesis of reduced
graphene. In this study, dry MW irradiation (MWI) synthesis of
the reduced graphene is successfully demonstrated and the MW
reduced GO shows a improved electrode performance when compared
to highly porous activated carbon; the state of the art
electrode material in commercial ultracapacitors.},
url = {https://www.researchgate.net/publication/224147776_Graphene_for_Ultracapacitors},
html = {https://www.researchgate.net/publication/224147776_Graphene_for_Ultracapacitors},
pdf = {2010IEEEMoon.pdf},
preview = {2010IEEEMoon.png},
altmetric = {true},
dimensions = {true},
selected = {true},
}
@conference{Zhang2010-rk,
title = {Recent advances on Electrically Conductive Adhesives},
author = {Zhang, Rongwei and Agar, Josh C and Wong, C P},
booktitle = {2010 12th Electronics Packaging Technology Conference},
publisher = {IEEE},
eventtitle = {2010 12th Electronics Packaging Technology Conference - (EPTC
2010)},
venue = {Singapore, Singapore},
eventdate = {2010-12-08},
pages = {696--704},
month = Dec,
year = 2010,
doi = {10.1109/eptc.2010.5702728},
abstract = {As one of the promising lead-free interconnection materials,
electrically conductive adhesive (ECA) has made considerable
advances in recent years. Compared to metal solder, ECAs offer
numerous advantages, such as environmental friendliness
(elimination of lead usage and flux cleaning), mild processing
conditions, fewer processing steps (reducing processing cost),
low stress on the substrates and fine pitch capability. However,
ECAs have some challenging issues, such as lower electrical and
thermal conductivities compared to solder joints, conductivity
fatigue in reliability tests, limited current carrying
capability, poor impact performance, etc. To meet specific
applications required for emerging electronic packaging
technologies, worldwide research efforts have been devoted to
improving the performance of ECAs, such as electrical and
mechanical properties and the reliability under various
conditions. Here, we summarize recent advances in isotropically
conductive adhesive (ICA) technology. We mainly discuss how the
electrical and reliability properties of ICAs can be engineered
for electronic packaging applications.},
url = {https://ieeexplore.ieee.org/document/5702728},
html = {https://ieeexplore.ieee.org/document/5702728},
pdf = {2010IEEEZhang.pdf},
preview = {2010IEEEZhang.gif},
altmetric = {true},
dimensions = {true},
selected = {true},
}
@thesis{Agar2011-ep,
type = {mathesis},
title = {Highly conductive stretchable electrically conductive
composites for electronic and radio frequency devices},
author = {Agar, Joshua C},
institution = {Georgia Institute of Technology},
location = {Georgia Institute of Technology},
month = May,
year = 2011,
abstract = {The electronics industry is shifting its emphasis from reducing
transistor size and operational frequency to increasing device
integration, reducing form factor and increasing the interface
of electronics with their surroundings. This new emphasis has
created increased demands on the electronic package. To
accomplish the goals to increase device integration and
interfaces will undoubtedly require new materials with
increased functionality both electrically and mechanically.
This thesis focuses on developing new interconnect and
printable conductive materials capable of providing power,
ground and signal transmission with enhanced electrical
performance and mechanical flexibility and robustness. More
specifically, we develop: 1.) A new understanding of the
conduction mechanism in electrically conductive composites
(ECC). 2.) Develop highly conductive stretchable silicone ECC
(S-ECC) via in-situ nanoparticle formation and sintering. 3.)
Fabricate and test stretchable radio frequency devices based on
S-ECC. 4.) Develop techniques and processes necessary to
fabricate a stretchable package for stretchable electronic and
radio frequency devices. In this thesis we provide convincing
evidence that conduction in ECC occurs predominantly through
secondary charge transport mechanism (tunneling, hopping).
Furthermore, we develop a stretchable silicone-based ECC which,
through the incorporation of a special additive, can form and
sinter nanoparticles on the surface of the metallic conductive
fillers. This sintering process decreases the contact
resistance and enhances conductivity of the composite. The
conductive composite developed has the best reported
conductivity, stretchability and reliability. Using this S-ECC
we fabricate a stretchable microstrip line with good
performance up to 6 GHz and a stretchable antenna with good
return loss and bandwidth. The work presented provides a
foundation to create high performance stretchable electronic
packages and radio frequency devices for curvilinear spaces.
Future development of these technologies will enable the
fabrication of ultra-low stress large area interconnects,
reconfigurable antennas and other electronic and RF devices
where the ability to flex and stretch provides additional
functionality impossible using conventional rigid electronics.},
url = {https://repository.gatech.edu/entities/publication/dce8ea0f-060f-47ff-b3cd-d193b9afdd57},
html = {https://repository.gatech.edu/entities/publication/dce8ea0f-060f-47ff-b3cd-d193b9afdd57},
pdf = {2011GTechAgar.pdf},
preview = {2011GTechAgar.png},
altmetric = {true},
dimensions = {true},
selected = {true},
}
@book{Rongwei-Zhang-Josh-C-Agar-C-P-Wong2011-gd,
title = {Conductive Polymer composites},
author = {{Rongwei Zhang, Josh C. Agar, C. P. Wong}},
editor = {{John Wiley & Sons, Inc.}},
booktitle = {Encyclopedia of polymer science and technology},
publisher = {John Wiley \& Sons, Inc.},
location = {Hoboken, NJ, USA},
month = jan,
year = 2011,
doi = {10.1002/0471440264.pst430.pub2},
abstract = {Insulating polymer materials can be made electronically
conductive through the incorporation of electrically conductive
fillers. These composite materials are called electrically
conductive polymer composites. This article reviews a special
class of conductive polymer composites—isotropically conductive
adhesives (ICAs). We summarize recent advances in ICA
technologies and its application as a lead-free alternative to
metal solders. We discuss how the properties of ICA can be
engineered for electronic packaging in terms of material
properties, conductive mechanisms, bulk conductivity, adhesion,
reliability, and cost. We conclude with a discussion of
commercial processes for ICA use in consumer electronics.},
url = {https://onlinelibrary.wiley.com/doi/book/10.1002/0471440264},
html = {https://onlinelibrary.wiley.com/doi/book/10.1002/0471440264},
pdf = {2011WileyZhang.pdf},
preview = {2011WileyZhang.jpg},
altmetric = {true},
dimensions = {true},
selected = {true},
}
@article{Zhang2011-dm,
title = {A simple, low-cost approach to prepare flexible highly
conductive polymer composites by in situ reduction of silver
carboxylate for flexible electronic applications},
author = {Zhang, Rongwei and Moon, Kyoung-Sik and Lin, Wei and Agar,
Josh C and Wong, Ching-Ping},
journaltitle = {Compos. Sci. Technol.},
publisher = {Elsevier BV},
volume = {71},
issue = {4},
pages = {528--534},
month = Feb,
year = 2011,
doi = {10.1016/j.compscitech.2011.01.001},
abstract = {In recent years, efforts to prepare flexible highly conductive
polymer composites at low temperatures for flexible electronic
applications have increased significantly. Here, we describe a
novel approach for the preparation of flexible highly
conductive polymer composites (resistivity: 2.5 x 10-5 Ω cm)
at a low temperature (150 °C), enabling the wide use of low
cost, flexible substrates such as paper and polyethylene
terephthalate (PET). The approach involves (i) in situ
reduction of silver carboxylate on the surface of silver
flakes by a flexible epoxy (diglycidyl ether of polypropylene
glycol) to form highly surface reactive nano/submicron-sized
particles; (ii) the in situ formed nano/submicron-sized
particles facilitate the sintering between silver flakes
during curing. Morphology and Raman studies indicated that the
improved electrical conductivity was the result of sintering
and direct metal-metal contacts between silver flakes. This
approach developed for the preparation of flexible highly
conductive polymer composites offers significant advantages,
including simple low temperature processing, low cost, low
viscosity, suitability for low-cost jet dispensing
technologies, flexibility while maintaining high conductivity,
and tunable mechanical properties. The developed flexible
highly conductive materials with these advantages are
attractive for current and emerging flexible electronic
applications.},
url = {https://www.sciencedirect.com/science/article/abs/pii/S0266353811000297},
html = {https://www.sciencedirect.com/science/article/abs/pii/S0266353811000297},
pdf = {2011ElsevierZhang.pdf},
preview = {2011ElsevierZhang.jpg},
altmetric = {true},
dimensions = {true},
selected = {true},
language = {en}
}
@article{Yao2011-rg,
title = {Controlled growth of multilayer, few-layer, and single-layer
graphene on metal substrates},
author = {Yao, Yagang and Li, Zhuo and Lin, Ziyin and Moon, Kyoung-Sik
and Agar, Josh and Wong, Chingping},
journaltitle = {J. Phys. Chem. C Nanomater. Interfaces},
publisher = {American Chemical Society (ACS)},
volume = {115},
issue = {13},
pages = {5232--5238},
month = Apr,
year = 2011,
doi = {10.1021/jp109002p},
abstract = {The effects of graphene growth parameters on the number of its
layers were systematically studied and a new growth mechanism
on Cu substrate was thus proposed. Through the investigation
of the graphene growth parameters, including growth substrate
types, carrier gases, types of carbon sources, growth
temperature, growth time, and cooling rates, we found that
graphene grows on Cu substrates via a surface-catalyzed
process, followed by a templated growth. We can obtain either
single layer graphene (SLG) or few-layer graphene (FLG) by
suppressing the subsequent templated growth with a low
concentration of carbon source gases and a high concentration
of H2. Our findings provide important guidance toward the
synthesis of large-scale and high-quality FLGs and SLGs. This
is expected to widen both the research and applications of
graphene.},
url = {https://m3-learning.com/wp-content/uploads/2018/11/Controlled-growth-of-multilayer-few-layer-and-single.pdf},
html = {https://m3-learning.com/wp-content/uploads/2018/11/Controlled-growth-of-multilayer-few-layer-and-single.pdf},
pdf = {2011JPhysChemYao.pdf},
preview = {2011JPhysChemYao.gif},
altmetric = {true},
dimensions = {true},
selected = {true},
language = {en}
}
@conference{Agar2011-ko,
title = {Through silicone vias: Multilayer interconnects for stretchable
electronics},
author = {Agar, Joshua C and Durden, Jessica and Zhang, Rongwei and
Staiculescu, Daniela and Wong, C P},
booktitle = {2011 IEEE 61st Electronic Components and Technology Conference
(ECTC)},
publisher = {IEEE},
eventtitle = {2011 IEEE 61st Electronic Components and Technology Conference
(ECTC)},
venue = {Lake Buena Vista, FL, USA},
eventdate = {2011-05-31},
pages = {1567--1571},
month = May,
year = 2011,
doi = {10.1109/ectc.2011.5898719},
abstract = {We show how stretchable Poly(dimethylsiloxane) (PDMS)
electrically conductive composites (ECC) can be fabricated to
form flexible, stretchable multilayer interconnects. Multilayer
integration through via-like structures enables increased
component interconnection and reduced form factor. We show a
unique process for forming stretchable multilayer interconnects
in PDMS via a bench-top layer-by-layer assembly technique. The
SCC is reliable under bending, tensile (ε=0.3) and compressive
strains. Furthermore, we show how the processes and package
designs developed can be applied to the fabrication of
stretchable devices. The techniques presented to fabricate
ultra-low cost, stretchable, 3D packages hold the potential
serve as a package for future stretchable electronic and radio
frequency devices.},
url = {https://www.researchgate.net/publication/224242720_Through_silicone_vias_Multilayer_interconnects_for_stretchable_electronics},
html = {https://www.researchgate.net/publication/224242720_Through_silicone_vias_Multilayer_interconnects_for_stretchable_electronics},
pdf = {2011IEEE61ElecAgar.pdf},
preview = {2011IEEE61ElecAgar.gif},
altmetric = {true},
dimensions = {true},
selected = {true},
language = {en}
}
@conference{Lin2011-bv,
title = {Surface engineering of graphene for high performance
supercapacitors},
author = {Lin, Ziyin and Liu, Yan and Yao, Yagang and Hildreth, Owen J and
Li, Zhuo and Moon, Kyoungsik and Agar, Joshua C and Wong,
Chingping},
booktitle = {2011 IEEE 61st Electronic Components and Technology Conference
(ECTC)},
publisher = {IEEE},
eventtitle = {2011 IEEE 61st Electronic Components and Technology Conference
(ECTC)},
venue = {Lake Buena Vista, FL, USA},
eventdate = {2011-05-31},
pages = {236--241},
month = May,
year = 2011,
doi = {10.1109/ectc.2011.5898519},
abstract = {A solvothermal method was used to synthesize functionalized
graphene, which exhibits an ultrahigh capacitance. This
solvothermal method allows a fine control of the density of
functionalities on graphene surface. The structure of resulting
functionalized graphene is characterized by X-ray photoelectron
spectroscopy (XPS), thermal gravimetric analysis (TGA), FTIR and
Raman. Pseudocapacitance is provided by functionalities on
graphene surface, such as carboxyl, carbonyl and hydroxyl. The
significance of these functional also includes improving the
wetting properties of electrode material, especially for
supercapacitors using aqueous electrolyte. However, there is a
penalty for functionalities since these oxygen-containing
functional groups will disrupt the π-conjugated system and lower
the electrical conductivity. Therefore for functionalized
graphene as supercapacitor, a tradeoff exists between the high
psudeocapacitance and low conductivity, both are arising from
the surface functionalities. Our systematic study shows a
successful control of the density of functionalities, which is
essential to achieve high performance of graphene-based
supercapacitors. The capacitance of graphene is measured in a
three electrode system using cyclic voltammetry (CV) and
galvanostatic charging/discharging techniques. At a proper
reduction condition, a high capacity of 276 F/g was achieved at
a discharging current of 0.1 A/g in H2SO4 solutions. The
superior capacitive performance of functionalized graphene
demonstrates the importance of surface property engineering,
which will greatly promote the study and application of
graphene-based supercapacitors.},
url = {https://ieeexplore.ieee.org/document/5898519},
html = {https://ieeexplore.ieee.org/document/5898519},
pdf = {2011IEEELin.pdf},
preview = {2011IEEELin.gif},
altmetric = {true},
dimensions = {true},
selected = {true},
language = {en}
}
@conference{Agar2011-pf,
title = {Kinetically controlled assembly of terpheny-4,4”-dithiol
self-assembled monolayers ({SAMs}) for highly conductive
anisotropically conductive adhesives ({ACA})},
author = {Agar, Joshua C and Durden, Jessica and Zhang, Rongwei and
Staiculescu, Daniela and Wong, C P},
booktitle = {2011 IEEE 61st Electronic Components and Technology Conference
(ECTC)},
publisher = {IEEE},
eventtitle = {2011 IEEE 61st Electronic Components and Technology Conference
(ECTC)},
venue = {Lake Buena Vista, FL, USA},
eventdate = {2011-05-31},
pages = {661--666},
month = May,
year = 2011,
doi = {10.1109/ectc.2011.5898584},
abstract = {Anisotropically conductive adhesives (ACA) are a promising
alternative to solder interconnects for high performance
electronic devices due to their increased I/O capabilities and
reduced form factor. Previous studies have shown that
modification of Au coated Ni/Cu bumps with conjugated
self-assembly monolayers (SAMs) increases conductivity, current
carrying capacity and reliability of ACA interconnects[1-3]. In
this study, we kinetically control the assembly of
p-Terphenyl-4,4”-dithiol (TPD) monolayers on Au bumps. Using a
custom designed test vehicle we show how TPD SAMs can either
increase or decrease the single bump resistance depending on the
kinetics of the monolayer formation and its resulting structure.
Future studies focusing on controlling monolayer assembly will
determine the efficacy of conjugated SAMs at enhancing the
conductivity and current carrying capacity of ACA interconnects.},
url = {https://ieeexplore.ieee.org/document/5898584},
html = {https://ieeexplore.ieee.org/document/5898584},
pdf = {2011IEEE61Agar.pdf},
preview = {2011IEEE61Agar.gif},
altmetric = {true},
dimensions = {true},
selected = {true},
language = {en}
}
@conference{Agar2011-mg,
title = {Electrically conductive silicone nano-composites for stretchable
{RF} devices},
author = {Agar, J and Durden, J and Staiculescu, D and Zhang, R and
Gebara, E and Wong, C P},
booktitle = {2011 IEEE MTT-S International Microwave Symposium},
publisher = {IEEE},
eventtitle = {2011 IEEE/MTT-S International Microwave Symposium - MTT 2011},
venue = {Baltimore, MD, USA},
eventdate = {2011-06-05},
pages = {1--4},
month = Jun,
year = 2011,
doi = {10.1109/mwsym.2011.5972952},
abstract = {The objective of this paper is to show how stretchable
conductive composites can be utilized for the fabrication of
ultra-low cost stretchable RF devices. We show a method to
produce biocompatible highly conductive stretchable silicone
composites via an in-situ nanoparticle formation and sintering
process. Furthermore, we develop a simple, low cost, processing
technique to fabricate stretchable RF transmission lines. These
RF transmission lines are highly flexible, stretchable and
robust. The S-parameter measurements show stable performance
during mechanical deformation up to 6 GHz. Future development of
this technology will enable ultra low cost consumer RF devices
serving as a platform for future stretchable electronic devices.},
url = {https://ieeexplore.ieee.org/document/5972952},
html = {https://ieeexplore.ieee.org/document/5972952},
pdf = {2011IEEEAgar.pdf},
preview = {2011IEEEAgar.gif},
altmetric = {true},
dimensions = {true},
selected = {true},
language = {en}
}
@conference{Cai2012-xf,
title = {Novel stretchable electrically conductive composites for tunable
{RF} devices},
author = {Cai, Fan and Li, Zhuo and Agar, Joshua C and Wong, C P and
Papapolymerou, John},
booktitle = {2012 IEEE/MTT-S International Microwave Symposium Digest},
publisher = {IEEE},
eventtitle = {2012 IEEE/MTT-S International Microwave Symposium - MTT 2012},
venue = {Montreal, QC, Canada},
eventdate = {2012-06-17},
pages = {1--3},
month = Jun,
year = 2012,
doi = {10.1109/mwsym.2012.6259638},
abstract = {Stretchable, flexible and tunable RF devices that are fabricated
with Polydimethylsiloxane (PDMS) Electrically Conductive
Composites (ECC) are presented. Using this composite material
allows mechanical modulation of the device dimensions resulting
in tuning of its frequency response. A planar loop antenna and a
5th order stepped impedance low pass filter operating around 1.5
GHz with tunability greater than 15\% are shown. The ECC can
reach an electrical resistivity as low as 10-4 Ω. cm, which is
close to a metal resistivity. The materials are also ultra-low
cost for massive fabrication. This technology opens the door for
tunable RF devices on flexible and curvilinear packages.},
url = {https://www.researchgate.net/publication/261345070_Novel_stretchable_electrically_conductive_composites_for_tunable_RF_devices},
html = {https://www.researchgate.net/publication/261345070_Novel_stretchable_electrically_conductive_composites_for_tunable_RF_devices},
pdf = {2012IEEECai.pdf},
preview = {2012IEEECai.gif},
altmetric = {true},
dimensions = {true},
selected = {true},
language = {en}
}
@article{Karthik2012-lg,
title = {Effect of 90° domain walls and thermal expansion mismatch on
the pyroelectric properties of epitaxial {PbZr0}.{2Ti0}.{8O3}
thin films},
author = {Karthik, J and Agar, J C and Damodaran, A R and Martin, L W},
journaltitle = {Phys. Rev. Lett.},
publisher = {American Physical Society (APS)},
volume = {109},
issue = {25},
pages = {257602},
month = Dec,
year = 2012,
doi = {10.1103/PhysRevLett.109.257602},
abstract = {We have investigated the contribution of 90° domain walls and
thermal expansion mismatch to pyroelectricity in
PbZr(0.2)Ti(0.8)O(3) thin films. The first phenomenological
models to include extrinsic and secondary contributions to
pyroelectricity in polydomain films predict significant
extrinsic contributions (arising from the
temperature-dependent motion of domain walls) and large
secondary contributions (arising from thermal expansion
mismatch between the film and the substrate). Phase-sensitive
pyroelectric current measurements are applied to model thin
films for the first time and reveal a dramatic increase in the
pyroelectric coefficient with increasing fraction of in-plane
oriented domains and thermal expansion mismatch.},
url = {https://escholarship.org/uc/item/4jh7q5q3},
html = {https://escholarship.org/uc/item/4jh7q5q3},
pdf = {2012PhysRevLettKarthik.pdf},
preview = {2012PhysRevLettKarthik.png},
altmetric = {true},
dimensions = {true},
selected = {true},
language = {en}
}
@article{Karthik2013-yz,
title = {Large built-in electric fields due to flexoelectricity in
compositionally graded ferroelectric thin films},
author = {Karthik, J and Mangalam, R V K and Agar, J C and Martin, L W},
journaltitle = {Phys. Rev. B Condens. Matter Mater. Phys.},
publisher = {American Physical Society (APS)},
volume = {87},
issue = {2},
pages = {024111},
month = Jan,
year = 2013,
doi = {10.1103/physrevb.87.024111},
abstract = {We investigate the origin of large built-in electric fields
that have been reported in compositionally graded
ferroelectric thin films using PbZr1-x Tix O3 (0.2 < x < 0.8)
as a model system. We show that the built-in electric fields
that cause a voltage offset in the hysteresis loops are
dependent on strain relaxation (through misfit dislocation
formation) and the accompanying polarization distribution
within the material. Using a Ginzburg- Landau-Devonshire
phenomenological formalism that includes the effects of
compositional gradients, mechanical strain relaxation, and
flexoelectricity, we demonstrate that the flexoelectric
coupling between the out-of-plane polarization and the
gradient of the epitaxial strain throughout the thickness of
the film, not other inhomogeneities (i.e., composition or
polarization), is directly responsible for the observed
voltage offsets. This work demonstrates the importance of
flexoelectricity in influencing the properties of
ferroelectric thin films and provides a powerful mechanism to
control their properties.},
url = {https://escholarship.org/uc/item/53q362hk},
html = {https://escholarship.org/uc/item/53q362hk},
pdf = {2013PhysRevKarthik.pdf},
preview = {2013PhysRevKarthik.png},
altmetric = {true},
dimensions = {true},
selected = {true},
}
@article{Mangalam2013-zk,
title = {Unexpected crystal and domain structures and properties in
compositionally graded {PbZr}(1-x)Ti(x){O3} thin films},
author = {Mangalam, R V K and Karthik, J and Damodaran, Anoop R and
Agar, Joshua C and Martin, Lane W},
journaltitle = {Adv. Mater.},
publisher = {Wiley},
volume = {25},
issue = {12},
pages = {1761--1767},
month = Mar,
year = 2013,
doi = {10.1002/adma.201204240},
abstract = {Synthesis of compositionally graded versions of
PbZr(1-x)Ti(x)O3 thin films results in unprecedented strains
(as large as ≈4.5 x 10(5) m(-1)) and correspondingly
unexpected crystal structures, ferroelectric domain
structures, and properties. This includes the observation of
built-in electric fields in films as large as 200 kV/cm.
Compositional and strain gradients could represent a new
direction of strain-control of materials.},
url = {https://pubmed.ncbi.nlm.nih.gov/23359407/},
html = {https://pubmed.ncbi.nlm.nih.gov/23359407/},
pdf = {2013AdvMatMangalam.pdf},
preview = {2013AdvMatMangalam.jpg},
altmetric = {true},
dimensions = {true},
selected = {true},
language = {en}
}
@article{Mangalam2013-pm,
title = {Improved pyroelectric figures of merit in compositionally
graded {PbZr1}-{xTixO3} thin films},
author = {Mangalam, R V K and Agar, J C and Damodaran, A R and Karthik,
J and Martin, L W},
journaltitle = {ACS Appl. Mater. Interfaces},
publisher = {American Chemical Society (ACS)},
volume = {5},
issue = {24},
pages = {13235--13241},
month = Dec,
year = 2013,
doi = {10.1021/am404228c},
abstract = {Pyroelectric materials have been widely used for a range of
thermal-related applications including thermal
imaging/sensing, waste heat energy conversion, and electron
emission. In general, the figures of merit for applications of
pyroelectric materials are proportional to the pyroelectric
coefficient and inversely proportional to the dielectric
permittivity. In this context, we explore single-layer and
compositionally graded PbZr1-xTixO3 thin-film heterostructures
as a way to independently engineer the pyroelectric
coefficient and dielectric permittivity of materials and
increase overall performance. Compositional gradients in thin
films are found to produce large strain gradients which
generate large built-in potentials in the films that can
reduce the permittivity while maintaining large pyroelectric
response. Routes to enhance the figures of merit of
pyroelectric materials by 3-12 times are reported, and
comparisons to standard materials are made.},
url = {https://pubmed.ncbi.nlm.nih.gov/24299171/},
html = {https://pubmed.ncbi.nlm.nih.gov/24299171/},
pdf = {2013ACSMangalam.pdf},
preview = {2013ACSMangalam.gif},
altmetric = {true},
dimensions = {true},
selected = {true},
language = {en}
}
@article{Agar2014-af,
title = {Tuning susceptibility via misfit strain in relaxed
morphotropic phase boundary {PbZr}$_{1-x}${ti}$_{x}${O}$_{3}$
epitaxial thin films},
author = {Agar, J C and Mangalam, R V K and Damodaran, A R and Velarde,
G and Karthik, J and Okatan, M B and Chen, Z H and Jesse, S
and Balke, N and Kalinin, S V and Martin, L W},
journaltitle = {Adv. Mater. Interfaces},
publisher = {Wiley},
volume = {1},
issue = {5},
pages = {1400098},
month = Aug,
year = 2014,
doi = {10.1002/admi.201400098},
abstract = {Epitaxial strain is a powerful tool to manipulate the
properties of ferroelectric materials. But despite extensive
work in this regard, few studies have explored the effect of
epitaxial strain on PbZr0.52Ti0.48O3. Here we explore how
epitaxial strain impacts the structure and properties of 75 nm
thick films of the morphotropic phase boundary composition.
Single-phase, fully epitaxial films are found to possess
“relaxed” or nearly “relaxed” structures despite growth on a
range of substrates. Subsequent studies of the dielectric and
ferroelectric properties reveal films with low leakage
currents facilitating the measurement of low-loss hysteresis
loops down to measurement frequencies of 30 mHz and dielectric
response at background dc bias fields as large as 850 kV/cm.
Despite a seeming insensitivity of the crystal structure to
the epitaxial strain, the polarization and switching
characteristics are found to vary with substrate. The elastic
constraint from the substrate produces residual strains that
dramatically alter the electric-field response including
quenching domain wall contributions to the dielectric
permittivity and suppressing field-induced structural
reorientation. These results demonstrate that substrate
mediated epitaxial strain of PbZr0.52Ti0.48O3 is more complex
than in conventional ferroelectrics with discretely defined
phases, yet can have a marked effect on the material and its
responses.},
url = {https://onlinelibrary.wiley.com/doi/abs/10.1002/admi.201400098},
html = {https://onlinelibrary.wiley.com/doi/abs/10.1002/admi.201400098},
pdf = {2014AdvMatAgar.pdf},
preview = {2014AdvMatAgar.png},
altmetric = {true},
dimensions = {true},
selected = {true},
language = {en}
}
@thesis{Agar2015-pn,
title = {New modalities of strain-based engineering of ferroelectrics:
Domain structure and properties of {PbZr1-} {xTixO3} thin films},
author = {Agar, Joshua C},
institution = {University of Illinois at Urbana-Champaign},
location = {University of Illinois at Urbana-Champaign},
year = 2015,
abstract = {Epitaxial strain has been widely used to modify the crystal and
domain structure, and ultimately the dielectric, ferroelectric,
and pyroelectric responses of ferroelectric thin-films for a
wide variety of applications including memories, transducers,
energy harvesters, sensors, and many more. Traditionally, the
ability to engineer materials using epitaxial strain has been
confined to a limited range of materials systems which are
closely lattice matched to commercially available substrates.
In turn, considering the PbZr 1- x Ti x O 3 system, a model
ferroelectric, study of strain effects has been primarily
limited to the Ti-rich variants where a wealth of closely
lattice matched substrates (~±1\%) exists, enabling
nearly-coherently-strained films to be obtained. While these
studies have generated a wealth of knowledge on the basic
effects of epitaxial strain and have demonstrated the ability
to enhance ferroelectric susceptibilities …},
url = {https://scholar.google.com/citations?view_op=view_citation&hl=en&citation_for_view=CfHw88sAAAAJ:KlAtU1dfN6UC},
html = {https://scholar.google.com/citations?view_op=view_citation&hl=en&citation_for_view=CfHw88sAAAAJ:KlAtU1dfN6UC},
pdf = {2015UIUCAgar.pdf},
preview = {2015UIUCAgar.png},
altmetric = {true},
dimensions = {true},
selected = {true},
language = {en}
}
@article{Agar2015-ei,
title = "Complex evolution of built-in potential in compositionally-graded
{PbZr}(1-x)ti(x){O3} thin films",
author = "Agar, Joshua C and Damodaran, Anoop R and Velarde, Gabriel A and
Pandya, Shishir and Mangalam, R V K and Martin, Lane W",
journal = "ACS Nano",
publisher = "American Chemical Society (ACS)",
volume = 9,
number = 7,
pages = "7332--7342",
abstract = "Epitaxial strain has been widely used to tune crystal and domain
structures in ferroelectric thin films. New avenues of strain
engineering based on varying the composition at the nanometer
scale have been shown to generate symmetry breaking and large
strain gradients culminating in large built-in potentials. In
this work, we develop routes to deterministically control these
built-in potentials by exploiting the interplay between strain
gradients, strain accommodation, and domain formation in
compositionally graded PbZr1-xTixO3 heterostructures. We
demonstrate that variations in the nature of the compositional
gradient and heterostructure thickness can be used to control
both the crystal and domain structures and give rise to
nonintuitive evolution of the built-in potential, which does not
scale directly with the magnitude of the strain gradient as would
be expected. Instead, large built-in potentials are observed in
compositionally-graded heterostructures that contain (1)
compositional gradients that traverse chemistries associated with
structural phase boundaries (such as the morphotropic phase
boundary) and (2) ferroelastic domain structures. In turn, the
built-in potential is observed to be dependent on a combination
of flexoelectric effects (i.e., polarization-strain gradient
coupling), chemical-gradient effects (i.e., polarization-chemical
potential gradient coupling), and local inhomogeneities (in
structure or chemistry) that enhance strain (and/or chemical
potential) gradients such as areas with nonlinear lattice
parameter variation with chemistry or near ferroelastic domain
boundaries. Regardless of origin, large built-in potentials act
to suppress the dielectric permittivity, while having minimal
impact on the magnitude of the polarization, which is important
for the optimization of these materials for a range of
nanoapplications from vibrational energy harvesting to thermal
energy conversion and beyond.",
month = jul,
year = 2015,
keywords = "PbZr1-xTixO3; compositionally-graded heterostructures;
ferroelectrics; permittivity; thin films",
language = "en",
url = {https://pubs.acs.org/doi/10.1021/acsnano.5b02289},
html = {https://pubs.acs.org/doi/10.1021/acsnano.5b02289},
pdf = {2015ACSNanoAgar.pdf},
doi = {10.1021/acsnano.5b02289},
preview = {2015ACSNanoAgar.gif},
altmetric = {true},
dimensions = {true},
selected = {true}
}
@article{Zhang2015-jv,
title = "Structural phase diagram and pyroelectric properties of
free-standing ferroelectric/non-ferroelectric multilayer
heterostructures",
author = "Zhang, Jialan and Agar, Josh C and Martin, Lane W",
journal = "J. Appl. Phys.",
publisher = "AIP Publishing",
volume = 118,
number = 24,
pages = 244101,
abstract = "Ginzburg-Landau-Devonshire models are used to explore
ferroelectric phases and pyroelectric coefficients of symmetric
free-standing, thin-film trilayer heterostructures composed of a
ferroelectric and two identical non-ferroelectric layers. Using
BaTiO3 as a model ferroelectric, we explore the influence of
temperature, in-plane misfit strain, and the non-ferroelectric
layer (including effects of elastic compliance and volume
fraction) on the phase evolution in the ferroelectric. The
resulting phase diagram reveals six stable phases, two of which
are not observed for thin films on semi-infinite cubic
substrates. From there, we focus on heterostructures with
non-ferroelectric layers of commonly available scandate materials
which are widely used as substrates for epitaxial growth. Again,
six phases with volatile phase boundaries are found in the phase
diagram for the NdScO3/BaTiO3/NdScO3 trilayerheterostructures.
The evolution of polarization and pyroelectric coefficients in
the free-standing NdScO3 trilayer heterostructures is discussed
with particular attention to the role that heterostructure design
plays in influencing the phase evolution and
temperature-dependence with a goal of creating enhanced
pyroelectric response and advantages over traditional thin-film
heterostructures.",
month = dec,
year = 2015,
url = {https://pubs.aip.org/aip/jap/article/118/24/244101/141440/Structural-phase-diagram-and-pyroelectric},